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repair:Leybold,Seiko
Seiki,Varian,Pfeiffer Balzers,Edwards,Adixen,Alcatel for use in:
Electron Microscopy (SEM, TEM),
Focused Ion-beam Systems (FIB) and Surface Analysis Modern focused-beam
systems such as SEM’s, TEM’s and FIB’s utilize columns that project
electrons or ions onto microscopic samples for detailed analysis. End
users analyze all types of substances from organic compounds to
semiconductor wafers. In the Semiconductor industry, in particular, they
require more sensitivity for better sample resolution. Another key
requirement is high sample throughput in order to lower the cost of
ownership of these instruments. Based on these requirements, the demand
for high performance vacuum pumps is greater than ever. Turbo molecular
pumps are also a key component in modern focused-beam systems because
they offer fast, oil-free air evacuation of large sample chambers
(oil-free operation is a key requirement of many modern analysis
applications such as semiconductor manufacturing)
Analytical Instrumentation Scientific Research A common misunderstanding is that by this method a hypothesis can be proven or tested. Generally a hypothesis is used to make predictions that can be tested by observing the outcome of an experiment. If the outcome is inconsistent with the hypothesis, then the hypothesis is rejected. However, if the outcome is consistent with the hypothesis, the experiment is said to support the hypothesis. This careful language is used because researchers recognize that alternative hypotheses may also be consistent with the observations. In this sense, a hypothesis can never be proven, but rather only supported by surviving rounds of scientific testing and, eventually, becoming widely thought of as true (or better, predictive), but this is not the same as it having been proven. A useful hypothesis allows prediction and within the accuracy of observation of the time, the prediction will be verified. As the accuracy of observation improves with time, the hypothesis may no longer provide an accurate prediction. In this case a new hypothesis will arise to challenge the old, and to the extent that the new hypothesis makes more accurate predictions than the old, the new will supplant it. Tool Coating PVD coatings on cutting tools - Saves companies billions In the areas of machining and tooling PVD coatings are widely used to increase the life and productivity of production cutting tools saving companies billions of dollars worldwide. The use of PVD coatings on cutting tools saves money in three ways. PVD coated cutting tools - Run tools faster Firstly PVD coated cutting tools can be run faster reducing cycle times and enabling the production of more components in less time. PVD coatings on cutting tools - Reduce wear and pickup In metal cutting different wear processes exist depending on the workpiece material. These wear mechanisms include abrasive wear on the flank and clearance face of the cutting tool, crater wear on the rake face, caused by chemical interaction between the cut chip and the tool surface, built-up edge on the cutting edge and depth-of-cut notching caused by abrasion by the outer edge of the chip. None of these wear mechanisms exists in isolation however one usually predominates. For example when cutting low-silicon aluminum a built-up-edge is generated that affects the quality of the finished product whereas high-silicon aluminum causes the tool to wear predominantly due to abrasion. PVD coatings are resistant to all forms of wear increasing the life of cutting tools reducing tool-changing costs. Electro-Beam Welding The electron beam gun used in EBW both produces the electrons and accelerates them, using a hot cathode emitter made of tungsten that emits electrons when heated. (Steigerwald also experimented with Tantalum filaments because of the lower work function). The electrons are then accelerated to a hollow anode inside the gun column by means of a high voltage differential. They pass through the anode at high speed (approx 1/2 the speed of light) and are then directed to the workpiece with magnetic forces resulting from focusing and deflection coils. These components are all housed in an electron beam gun column, in which a hard vacuum (about 0.00001 torr) is maintained. The EBW power supply pulls a low current (usually less than 1 A), but provides a voltage as high as 60 kV in low-voltage machines, or 200 kV in high-voltage machines. High-voltage machines supply a current as low as 40 mA, and can provide a weld depth-to-width ratio of 25:1, whereas the ratio with a low-voltage machine is around 12:1. The beam power of a power supply is an indicator of its ability to do work, and determines the power density (generally 40-4000 kW/cm² or 100-10,000 kW/in²). For the hard vacuum and soft vacuum EBW methods, the welding chamber used must be airtight and strong enough to prevent it from being crushed by atmospheric pressure. It must have openings so that the workpieces can be inserted and removed, and its size must be sufficient to hold the workpieces but not significantly larger, as larger chambers require more time to evacuate. The chamber must also be equipped with pumps capable of evacuating it to the desired pressure. For a hard vacuum, a diffusion pump is necessary, while soft vacuums can often be obtained by less costly equipment. Electron beams can also be sent from their vacuum column through membrane or plasma window for a short distance into the air and this is used for production welding, for example welding the hard teeth of hack saw blades onto a tougher backing steel. The plasma window is a relatively recent advance which has turned this kind of EBW into a far more practical tool. Previously the vacuum containment membranes were expensive and degraded quickly by the constant stream of high energy electrons. Semiconductors The turbo pump is the critical element in the creation of an appropriate environment in the world of semiconductor manufacturing. In fact, as semiconductor chip geometries continue to shrink, the reliance on turbo pump technology is the highest it has been in the history of semiconductor manufacturing. Turbo pumps provide unique and critical advantages in the creation of vacuum for the manufacture of semiconductor devices. High Energy Physics Turbomolecular pumps are widely used in High Energy Physics, Fusion Technology and general UHV research. Synchrotron Light Sources, Particle Accelerator Rings, UHV Laboratory research, and Fusion reactors need extremely clean, reliable and cost effective HV and UHV. Maintenance-free pumps are specifically required, because most pumps are not easily accessible. Ceramic bearing pumps, thanks to their reduced rolling friction, low stress and high thermal stability compared to conventional bearings, deliver longer operating life. Ultra low vapor pressure solid lubricant eliminates the need for maintenance and assures clean operation under any operating conditions. Vacuum Metallurgy The making, shaping, and treating of metals, alloys, and intermetallic and refractory metal compounds in a gaseous environment where the composition and partial pressures of the various components of the gas phase are carefully controlled. In many instances, this environment is a vacuum ranging from subatmospheric to ultrahigh vacuum (less than 760 torr or 101 kilopascals to 10-12 torr or 10-10 pascal). In other cases, reactive gases are deliberately added to the environment to produce the desired reactions, such as in reactive evaporation and sputtering processes and chemical vapor depositon. The processes in vacuum metallurgy involve liquid/solid, vapor/solid, and vapor/liquid/solid transitions. In addition, they include testing of metals in controlled environments. There are three basic reasons for vacuum processing of metals: elimination of contamination from the processing environment, reduction of the level of impurities in the product, and deposition with a minimum of impurities. Contamination from the processing environment includes the container for the metal and the gas phase surrounding the metal. In the vacuum process, impurities, particularly oxygen, nitrogen, hydrogen, and carbon, are released from the molten metal and pumped away; and metals, alloys, and compounds are deposited with a minimum of entrained impurities. There are numerous and varied application areas for vacuum metallurgy including special areas of extractive metallurgy, melting processes, casting of shaped products, degassing of molten steel, heat treatment, surface treatment, vapor deposition, space processing, and joining processes. Solar Cells Many new solar cells use transparent thin films that are also conductors of electrical charge. The dominant conductive thin films used in research now are transparent conductive oxides (abbreviated "TCO"), and include fluorine-doped tin oxide (SnO2:F, or "FTO"), doped zinc oxide (e.g.: ZnO:Al), and indium tin oxide (abbreviated "ITO"). These conductive films are also used in the LCD industry for flat panel displays. The dual function of a TCO allows light to pass through a substrate window to the active light-absorbing material beneath, and also serves as an ohmic contact to transport photogenerated charge carriers away from that light-absorbing material. The present TCO materials are effective for research, but perhaps are not yet optimized for large-scale photovoltaic production. They require very special deposition conditions at high vacuum, they can sometimes suffer from poor mechanical strength, and most have poor transmittance in the infrared portion of the spectrum (e.g.: ITO thin films can also be used as infrared filters in airplane windows). Solar Energy Solar energy refers primarily to the use of solar radiation for practical ends. However, all renewable energies, other than geothermal and tidal, derive their energy from the sun. Solar technologies are broadly characterized as either passive or active depending on the way they capture, convert and distribute sunlight. Active solar techniques use photovoltaic panels, pumps, and fans to convert sunlight into useful outputs. Passive solar techniques include selecting materials with favorable thermal properties, designing spaces that naturally circulate air, and referencing the position of a building to the Sun. Active solar technologies increase the supply of energy and are considered supply side technologies, while passive solar technologies reduce the need for alternate resources and are generally considered demand side technologies Thin Film Thin films are thin material layers ranging from fractions of a nanometre (monolayer) to several micrometres in thickness. Electronic semiconductor devices and optical coatings are the main applications benefiting from thin film construction. A familiar application of thin films is the household mirror which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors. A very thin film coating (less than a nanometre) is used to produce two-way mirrors. The act of applying a thin film to a surface is thin-film deposition - any technique for depositing a thin film of material onto a substrate or onto previously deposited layers. The material to be deposited is placed in an energetic, entropic environment, so that particles of material escape its surface. Facing this source is a cooler surface which draws energy from these particles as they arrive, allowing them to form a solid layer. The whole system is kept in a vacuum deposition chamber, to allow the particles to travel as freely as possible. Since particles tend to follow a straight path, films deposited by physical means are commonly directional, rather than conformal. Example of physical deposition: A thermal evaporator uses an electric resistance heater to melt the material and raise its vapor pressure to a useful range. This is done in a high vacuum, both to allow the vapor to reach the substrate without reacting with or scattering against other gas-phase atoms in the chamber, and reduce the incorporation of impurities from the residual gas in the vacuum chamber. Obviously, only materials with a much higher vapor pressure than the heating element can be deposited without contamination of the film. Molecular beam epitaxy is a particular sophisticated form of thermal evaporation.
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